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1 . Conference
Packaging for fast switching power electronics
저자
by
Marchant, Stewart
;
Dai, Jingru
;
Mouawad, Bassem
;
Empringham, Lee
;
Clare, Jon
.
소스
2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP) Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP), 2023 IEEE 8th Southern. :1-6 Nov, 2023
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7 . Academic Journal
Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process
저자
by
Dai, Jingru
;
Li, Jianfeng
;
Agyakwa, Pearl
;
Corfield, Martin
;
Johnson, Christopher Mark
.
소스
In
Microelectronics Reliability
August 2020 111
Full Text (ScienceDirect)
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7 . Academic Journal
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints
저자
by
Li, Jianfeng
;
Dai, Jingru
;
Johnson, Christopher Mark
.
소스
In
Microelectronics Reliability
May 2018 84:55-65
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5 . Academic Journal
Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling.
저자
by
Agyakwa, Pearl A.
;
Robertson, Stuart
;
Dai, Jingru
;
Mouawad, Bassem
;
Zhou, Zhaoxia
, et al.
소스
Journal of Electronic Materials; Mar2024, Vol. 53 Issue 3, p1374-1398, 25p
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7 . Academic Journal
Low-Temperature Die Attachment by Pressureless Cu Sintering for Semiconductor Packaging.
저자
by
Dai, Jingru
;
Wang, Yangang
;
Grant, Thomas
;
Morshed, Muhmmad
.
소스
Journal of Electronic Materials; Nov2023, Vol. 52 Issue 11, p7607-7613, 7p
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6 . Conference
A High Performance and Low Cost Half Bridge IGBT Planar Power Module
저자
by
Li, Jainfeng
;
Li, Ke
;
Dai, Jingru
;
Johnson, Christopher Mark
;
Lin, Xi
.
소스
2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :329-334 Aug, 2018
Full Text (IEEE)
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7 . Conference
Thermal performance and reliability of high temperature SiC power module with direct-cooled stacked Si3N4 substrates
저자
by
Dai, Jingru
;
Li, Jianfeng
;
Mouawad, Bassem
;
Johnson, Christopher Mark
.
소스
2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia), 2018 1st Workshop on. :23-33 May, 2018
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6 . Dissertation/ Thesis
Process and reliability of die attachment by time-reduced sintering of nanosilver film
저자
by
Dai, Jingru
.
소스
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3 . Academic Journal
Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process.
저자
by
Dai, Jingru
;
Li, Jianfeng
;
Agyakwa, Pearl
;
Corfield, Martin
;
Johnson, Christopher Mark
.
소스
IEEE Transactions on Device & Materials Reliability; Dec2021, Vol. 21 Issue 4, p536-543, 8p
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7 . Academic Journal
Effect of Crack Evolution on the Resistance and Current Density of the Al Metallization in the IGBT Module During Power Cycling.
저자
by
Qin, Fei
;
Zhao, Jingyi
;
An, Tong
;
Dai, Jingru
;
Dai, Yanwei
, et al.
소스
IEEE Transactions on Device & Materials Reliability; Dec2020, Vol. 20 Issue 4, p706-715, 10p
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