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1 . Report
Encoding optimization for quantum machine learning demonstrated on a superconducting transmon qutrit
저자
by
Cao, Shuxiang
;
Zhang, Weixi
;
Tilly, Jules
;
Agarwal, Abhishek
;
Bakr, Mustafa
, et al.
소스
Open Access (Arxiv)
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7 . Report
Emulating two qubits with a four-level transmon qudit for variational quantum algorithms
저자
by
Cao, Shuxiang
;
Bakr, Mustafa
;
Campanaro, Giulio
;
Fasciati, Simone D.
;
Wills, James
, et al.
소스
Open Access (Arxiv)
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7 . Report
Efficient characterization of qudit logical gates with gate set tomography using an error-free Virtual-Z-gate model
저자
by
Cao, Shuxiang
;
Lall, Deep
;
Bakr, Mustafa
;
Campanaro, Giulio
;
Fasciati, Simone
, et al.
소스
Open Access (Arxiv)
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7 . Conference
Android development based education for deaf and dumb people.
저자
by
Hemalatha, S.
;
Kanimozhi, K. V.
;
Nagappan, G.
;
Mahesh, Senthil
;
Perumal, P.
, et al.
소스
AIP Conference Proceedings
. 2024, Vol. 2816 Issue 1, p1-9. 9p.
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7 . Conference
Dielectric Materials Characterization for Hybrid Bonding
저자
by
Chidambaram, Vivek
;
Lianto, Prayudi
;
Wang, Xiangyu
;
See, Gilbert
;
Wiswell, Nicholas
, et al.
소스
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :426-431 Jun, 2021
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7 . Conference
Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications
저자
by
Siang Lim, Sharon Pei
;
Chong, Ser Choong
;
Chidambaram, Vivek
.
소스
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :438-444 Jun, 2021
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5 . Academic Journal
Total losses and dispersion effects management and upgrading fiber reach in ultra-high optical transmission system based on hybrid amplification system
저자
by
Ramkumar, Govindaraj
;
Shahila, Ferlin Deva
;
Lingaraj, Vanitha
;
Chandran, Prabhu
;
Chidambaram, Vivek
, et al.
소스
Journal of Optical Communications
.
Full Text(De Gruyter)
Scopus
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7 . Conference
Non-destructive fault isolation in through-silicon interposer based system in package
저자
by
Gourikutty, Sajay Bhuvanendran Nair
;
Chua, Kok Keng
;
Alton, Jesse
;
Chinq, Jong Ming
;
Umralkar, Ratan Bhimrao
, et al.
소스
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :281-285 Dec, 2020
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7 . Conference
Wafer Level Fine-Pitch Hybrid Bonding: Challenges and Remedies
저자
by
Chidambaram, Vivek
;
Leong, Yew Wing
;
Ren, Qin
.
소스
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :459-463 Dec, 2020
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5 . Conference
Wafer Level Fusion and Hybrid Bonding: Impact of Critical Process Parameters on Bond Quality
저자
by
Chidambaram, Vivek
;
Ren, Qin
;
Kawano, Masaya
.
소스
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :663-666 Dec, 2019
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