microelectronics reliability (23)
microelectronic engineering (18)
ieee transactions on advanced packaging (16)
journal of the chinese institute of engineers (10)
ieee transactions on components & packaging technologies (9)
ieee transactions on components, packaging & manufacturing technology (9)
thin solid films (9)
materials (1996-1944) (8)
journal of electronic materials (5)
finite elements in analysis & design (4)
journal of electronic packaging (4)
journal of mechanics (4)
proceedings of spie (4)
computational materials science (3)
ieee transactions on device & materials reliability (3)
international journal of advanced manufacturing technology (3)
2008 3rd international microsystems, packaging, assembly & circuits technology conference, microsystems, packaging, assembly & circuits technology conference, 2008. impact 2008. 3rd international (2)
2010 12th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems, thermal and thermomechanical phenomena in electronic systems (itherm), 2010 12th ieee intersociety conference on (2)
2010 5th international microsystems packaging assembly and circuits technology conference, microsystems packaging assembly and circuits technology conference (impact), 2010 5th international (2)
2014 15th international conference on thermal, mechanical & multi-physics simulation & experiments in microelectronics & microsystems (eurosime) (2)
2014 15th international conference on thermal, mechanical and mulit-physics simulation and experiments in microelectronics and microsystems (eurosime), thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on (2)
2014 9th international microsystems, packaging, assembly & circuits technology conference (impact) (2)
2014 9th international microsystems, packaging, assembly and circuits technology conference (impact), microsystems, packaging, assembly and circuits technology conference (impact), 2014 9th international (2)
2015 16th international conference on thermal, mechanical & multi-physics simulation & experiments in microelectronics & microsystems (2)
2015 16th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems, thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2015 16th international conference on (2)
2015 international conference on electronic packaging & imaps all asia conference (icep-iaac) (2)
2015 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iacc), 2015 international conference on (2)
2016 11th international microsystems, packaging, assembly & circuits technology conference (impact) (2)
2016 11th international microsystems, packaging, assembly and circuits technology conference (impact), microsystems, packaging, assembly and circuits technology conference (impact), 2016 11th international (2)
2016 international conference on electronics packaging (icep) (2)
2016 international conference on electronics packaging (icep), electronics packaging (icep), 2016 international conference on (2)
2019 international conference on electronics packaging (icep), electronics packaging (icep), 2019 international conference on (2)
carbon (2)
chemphyschem (2)
chinese journal of mechanics: series a (2)
intermetallics (2)
solid-state electronics (2)
2006 international conference on electronic materials and packaging, electronic materials and packaging, 2006. emap 2006. international conference on (1)
2007 proceedings 57th electronic components and technology conference, electronic components and technology conference, 2007. ectc '07. proceedings. 57th (1)
2008 10th electronics packaging technology conference, electronics packaging technology conference, 2008. eptc 2008. 10th (1)
2008 11th intersociety conference on thermal and thermomechanical phenomena in electronic systems, thermal and thermomechanical phenomena in electronic systems, 2008. itherm 2008. 11th intersociety conference on (1)
2008 2nd electronics system-integration technology conference, electronics system-integration technology conference, 2008. estc 2008. 2nd (1)
2009 4th international microsystems, packaging, assembly and circuits technology conference, microsystems, packaging, assembly and circuits technology conference, 2009. impact 2009. 4th international (1)
2009 european microelectronics and packaging conference, microelectronics and packaging conference, 2009. empc 2009. european (1)
2010 11th international thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems (eurosime), thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems (eurosime), 2010 11th international conference on (1)
2010 ieee cpmt symposium japan, cpmt symposium japan, 2010 ieee (1)
2010 international conference on nanoscience and nanotechnology, nanoscience and nanotechnology (iconn), 2010 international conference on (1)
2011 12th intl. conf. on thermal, mechanical & multi-physics simulation and experiments in microelectronics and microsystems, thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2011 12th international conference on (1)
2011 6th international microsystems, packaging, assembly and circuits technology conference (impact), microsystems, packaging, assembly and circuits technology conference (impact), 2011 6th international (1)
2012 14th international conference on electronic materials and packaging (emap), electronic materials and packaging (emap), 2012 14th international conference on (1)