2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2021 IEEE International Conference on. :1-4 Jun, 2021
2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2020 Symposium on. :1-4 Jun, 2020
2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2018 Symposium on. :1-5 May, 2018
2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2018 Symposium on. :1-6 May, 2018