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1 .
Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer
저자
by
Joungho Kim
;
Rao Tummala
;
Kyungjune Son
;
Pulugurtha Markondeya Raj
;
Youngwoo Kim
, et al.
소스
IEEE Transactions on Electromagnetic Compatibility
. 63:1562-1573
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7 .
Characterization of ABF/Glass/ABF Substrates for mmWave Applications
저자
by
Mutee ur Rehman
;
Madhavan Swaminathan
;
Atom Watanabe
;
Siddharth Ravichandran
;
Serhat Erdogan
.
소스
IEEE Transactions on Components, Packaging and Manufacturing Technology
. 11:384-394
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7 .
A Review of 5G Front-End Systems Package Integration
저자
by
Atom Watanabe
;
Sk Yeahia Been Sayeed
;
Rao Tummala
;
Markondeya Raj Pulugurtha
;
Muhammad Ali
.
소스
IEEE Transactions on Components, Packaging and Manufacturing Technology
. 11:118-133
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7 .
Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications
저자
by
Pulugurtha Markondeya Raj
;
Madhavan Swaminathan
;
Rao Tummala
;
Kimiyuki Kanno
;
Tong-Hong Lin
, et al.
소스
IEEE Antennas and Wireless Propagation Letters
. 19:1963-1967
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7 .
Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration
저자
by
Pulugurtha Markondeya Raj
;
Yiteng Wang
;
Nobuo Ogura
;
Atom Watanabe
;
Rao Tummala
.
소스
Journal of Electronic Materials
. 49:6737-6745
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7 .
Advanced Low Df Dry film Build-up Material on Glass panel for 5G application
저자
by
Takenori Kakutani
;
Yuya Suzuki
;
Atom Watanabe
;
Mohanalingam Kathaperumal
;
Zhong Guan
, et al.
소스
International Symposium on Microelectronics
. 2020:000201-000205
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7 .
Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands
저자
by
Muhammad Ali
;
Manos M. Tentzeris
;
Atom Watanabe
;
Rao Tummala
;
Markondeya Raj Pulugurtha
, et al.
소스
IEEE Transactions on Components, Packaging and Manufacturing Technology
. 10:1515-1523
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7 .
Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages
저자
by
Raj Pulugurtha Markondeya
;
Madhavan Swaminathan
;
Hirokazu Ito
;
Atom Watanabe
;
Rao Tummala
.
소스
IEEE Transactions on Components, Packaging and Manufacturing Technology
. 10:870-877
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7 .
Innovative Sub-5-$\mu$ m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects
저자
by
Chandrasekharan Nair
;
Gaurav Khurana
;
Rui Zhang
;
Fuhan Liu
;
Rao Tummala
, et al.
소스
IEEE Transactions on Components, Packaging and Manufacturing Technology
. 9:2016-2023
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7 .
First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications
저자
by
Rao Tummala
;
Mohanalingam Kathaperumal
;
Siddharth Ravichandran
;
Nobuo Ogura
;
Atom Watanabe
, et al.
소스
International Symposium on Microelectronics
. 2019:000202-7
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