Hermetic sealing of hybrid microcircuits: initial capability development
- Resource Type
- Technical Report
- Authors
- Source
- Subject
- 42 ENGINEERING MICROELECTRONIC CIRCUITS
SEALS
GOLD
HYBRID SYSTEMS
LEAKS
SEALING MATERIALS
SOLDERED JOINTS
TIN
ELECTRONIC CIRCUITS
ELEMENTS
JOINTS
METALS
TRANSITION ELEMENTS 420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
- Language
- English
The capability to hermetically seal hybrid microcircuits has been established. Tests indicate that helium fine leak rates in the low 10/sup -8/ STP cm/sup 3//s region and moisture content of less than 500 ppm are obtained with the 80% gold--20% tin solder sealing process being used. Initial production results indicate a yield of bettr than 90% for the process. Work is continuing to improve the capability to reseal packages that have been opened for rework. Future efforts will include evaluations of moisture sensors for use in hybrid packages, particle impact noise detection testing of sealed packages, and the use of laser welding as an alternate method for sealing packages.