For Heterojunction technology (HJT) solar cells, a low-temperature Ag paste is used for metallization because the passivation layer on the HJT solar cells is deteriorated at 200°C or above. However, it is challenging to interconnect HJT solar cells because a low-temperature Ag paste shows the poor peel strength between cell and electrode after the cell interconnection process. In this study, electrically conductive adhesives (ECAs) were incorporated for the multi-busbar (MBB) interconnection process of HJT solar cells to overcome the problem. Three screens with different mesh wire diameters were tested to investigate the correlation between cured ECAs thickness and peel strength of soldered wires to the busbar using infrared (IR) lamp. The peel strength was evaluated by varying the IR lamp and hotplate temperature based on the cured ECAs thickness, and as a result, maximum peel strength of over 1 N/mm was secured. We were confirmed that multi-busbar interconnection of HJT solar cells is possible even after ECAs curing, unlike the existing method.