A film is provided that is formed of at least one kind of a thermoplastic resin (A), selected from the group consisting of a polyvinyl acetal resin, a polyethylene vinyl acetate copolymer resin, a polyurethane resin, a polyester resin, and a polyacrylic resin, and contains microparticles of a copper compound (B) having an average particle diameter of 200 nm or less. The film is excellent in transparency, a heat-shielding property, electromagnetic wave permeability, and durability, so that it is suitable to be an interlayer film for laminated glass.