In this paper, we propose a new stretchable interconnect method that can be improved dramatically the tensile rate and durability of the circuit board for wearable computer. Previously reported method is to implement the stretchable structure, by designing the twisted geometry shape which is using metallic electrode materials without the stretch property, but it is not easily commercialized because of the low tensile durability. To solve this problem, we propose a relatively simple method for rapid fabrication of stretchable interconnect technology with highly repetition tensile durability using conductive yarns. As the result of experiments was conducted in order to evaluate the repetition tensile durability, We verify that the proposed method has excellent the stability of the electrical conductivity and robustness, which is in capable of withstanding repeated stretch-and-release cycles of over 20,000 at 130% strain, which is 2.3 times of its original length.