56 nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme
- Resource Type
- Article
- Authors
- Loquet, Yannick; Mignot, Yann; Waskiewicz, Christopher; Chen, James Hsueh-Chung; Sankarapandian, Muthumanickam; Chen, Shyng-Tsong; Flaitz, Philip; Tomizawa, Hideyuki; Tseng, Chia-Hsun; Beard, Marcy; Morris, Bryan; Kleemeier, Walter; Liniger, E.; Spooner, Terry
- Source
- In Microelectronic Engineering July 2013 107:138-144
- Subject
- Language
- ISSN
- 0167-9317