Design and Fabrication of Microwave Module with Multiple Liquid Crystal Polymer Flex
- Resource Type
- Conference
- Authors
- Luo, Yan; Zhang, Lizheng; Zhao, Jiaqing; Zhou, Yi; Zhao, Yong; Wang, Lichun
- Source
- 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT) Microwave and Millimeter Wave Technology (ICMMT), 2020 International Conference on. :1-3 Sep, 2020
- Subject
- Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Fabrication
Microwave integrated circuits
Lamination
Liquid crystal polymers
Nonhomogeneous media
Microwave amplifiers
Substrates
LCP
lamination process
conform
module.
- Language
In this paper, we present the design and fabrication of low noise amplified module with multilayer liquid crystal polymer (LCP) flex. The technological process of module fabrication is designed according to the module structure. The lamination process is optimized to enhance the lamination strength and eliminate the wrinkle. The LCP substrate is conformed to 0 degree, 10 degree and 45 degree before die bonding to protect the chip from bending strength. The results show that the module remain well performance at different curvature. The LCP substrate has a good potential in flexible front-end module.