Innovative Packaging Integration Strategy for BiCMOS ICs Operating beyond 200 GHz
- Resource Type
- Conference
- Authors
- Ovalle-Taylor, David A.; Gianesello, Frederic; Luxey, Cyril; Ducournau, Guillaume
- Source
- 2023 53rd European Microwave Conference (EuMC) Microwave Conference (EuMC), 2023 53rd European. :6-9 Sep, 2023
- Subject
- Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Waveguide transitions
Microwave technology
Stripline
Insertion loss
Packaging
BiCMOS integrated circuits
Silicon
BiCMOS
E-plane probe transition
metallic split-blocks
organic laminate substrate
waveguide to suspended stripline transition
- Language
In this paper, an innovative packaging integration strategy compatible with Silicon-based technologies is proposed. It is assessed beyond 200 GHz by the integration of a BiCMOS WR3 back-to-back waveguide (WG) to suspended stripline (SSL) transition in organic laminate substrate. An insertion loss below 3 dB is obtained in the 220-320 GHz band, competing with traditional solutions using III-V substrates. Achieved performances are promising and could enable sub-THz volume-manufacturing packaging solutions for Silicon technologies.