Reliability Prediction and Improvement of Board-Level Thermal Cycling Test for Molded Flip-Chip Ball-Grid-Array Package
- Resource Type
- Conference
- Authors
- Chen, Dao-Long; Chen, Tang-Yuan; Lai, Wei-Hong; Yin, Wei-Jie; Kuo, Chun-Liang; Ko, Chun-Yu; Cheng, Chi-Min
- Source
- 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :995-998 Dec, 2023
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Schedules
Parametric study
Creep
Focusing
Materials reliability
Predictive models
Data models
- Language
The study focused on the Board-Level Thermal Cycling Test (BL-TCT) reliability of the Molded Flip-Chip Ball-Grid-Array (MFCBGA) package. The Anand viscoplastic model was used to describe the plastic and creep behaviors of the solder material. The lifecycle prediction model with Morrow’s energy based method was used to fit a number of data points and the deviation of characteristic lifecycle can be predicted within ±15%. Furthermore, the parametric studies were conducted to enhance the lifecycle of MFCBGA series.