SI and design considerations for Gbps PCBs in communication systems
- Resource Type
- Conference
- Authors
- Zhen Mu; Willis, K.
- Source
- IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2001. :287-290 2001
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Crosstalk
Dielectric losses
Skin effect
Backplanes
Signal design
Reflection
Propagation losses
Dielectric materials
Frequency dependence
Geometry
- Language
This paper covers the board level signal integrity issues at Gbps rates, impact of pre-emphasis, interconnect design considerations, and plane configuration techniques for power delivery. Pre-defined rules can be drawn from the discussion to guide high speed board designs.