Premold on Substrate for MEMS Package
- Resource Type
- Conference
- Source
- 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :1673-1677 Jun, 2007
- Subject
Components, Circuits, Devices and Systems Engineered Materials, Dielectrics and Plasmas Photonics and Electrooptics Micromechanical devices Plastic packaging Wafer scale integration Costs Microphones Application specific integrated circuits Substrates Semiconductor device packaging Integrated circuit packaging Integrated circuit technology - Language
- ISSN
- 0569-5503
2377-5726