Hybrid III-V/SOI Optoelectronic Laser Module
- Resource Type
- Conference
- Authors
- Shubin, I.; Yao, J.; Lee, J. -H.; Djordjevic, S. S.; Bovington, J.; Zhang, C.; Thacker, H.; Lin, S.; Lee, D.; Luo, Y.; Raj, K.; Cunningham, J. E.; Krishnamoorthy, A. V.; Zheng, X.
- Source
- 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1069-1074 May, 2016
- Subject
- Components, Circuits, Devices and Systems
Optical waveguides
Waveguide lasers
Optical coupling
Silicon
Laser modes
Surface emitting lasers
Mirrors
Si photonics
III-V/SOI integration
lasers
- Language
We report a compact laser on-chip module that is hybrid integrated with photonic circuits. Arrays of III-V MQW lasers were flip-chip bonded onto an SOI interposer along with micro-machined mirrors for optical coupling into a dedicated grating coupler array. This is a new wafer-scale opto-electronic integration platform enabling photonic links with built-in high efficiency light sources.