Precise thixotropy controlled Bump Support Film for WLCSP
- Resource Type
- Conference
- Authors
- Shinomiya, Keisuke; Saiki, Naoya; Sato, Yousuke; Miyawaki, Manabu; Morishita, Tomotaka; Kainuma, Reina
- Source
- 2021 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2021 IEEE. :53-56 Nov, 2021
- Subject
- Bioengineering
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Presses
Sensitivity
Lamination
Process control
Resins
Strain
WLCSP
Thermoset resin
Laminating process
- Language
- ISSN
- 2475-8418
This research focuses on the application of the resin with fluidity to the uneven surface of bump wafers. We have solved the problem of staining that occurs when pouring resin by controlling the thixotropy of the material.