Hybrid silicon photonics flip-chip laser integration with vertical self-alignment
- Resource Type
- Conference
- Authors
- Moscoso-Martir, A.; Merget, F.; Mueller, J.; Hauck, J.; Romero-Garcia, S.; Shen, B.; Lelarge, F.; Brenot, R.; Garreau, A.; Mentovich, E.; Sandomirsky, A.; Badihi, A.; Rasmussen, D. E.; Setter, R.; Witzens, J.
- Source
- 2017 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR) Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2017 Conference on. :1-4 Jul, 2017
- Subject
- Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
General Topics for Engineers
Lasers
Waveguide lasers
Flip-chip devices
Optical waveguides
Silicon
Photonics
Substrates
silicon photonics
hybrid integration
flip-chip integration
flip-chip laser
- Language
We present a flip-chip integration process in which the vertical alignment is guaranteed by a mechanical contact between pedestals defined in a recess etched into a silicon photonics chip and a laser or semiconductor optical amplifier. By selectively etching up to the active region of the III-V materials, we can make the accuracy of vertical alignment independent on the process control applied to layer thicknesses during silicon photonics or III-V chip fabrication, enabling alignment tolerances below ±10 nm in the vertical (Z-)direction.