A Highly Integrated 60 GHz 6-Channel Transceiver With Antenna in Package for Smart Sensing and Short-Range Communications
- Resource Type
- Periodical
- Authors
- Nasr, I.; Jungmaier, R.; Baheti, A.; Noppeney, D.; Bal, J.S.; Wojnowski, M.; Karagozler, E.; Raja, H.; Lien, J.; Poupyrev, I.; Trotta, S.
- Source
- IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 51(9):2066-2076 Sep, 2016
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Computing and Processing
Transmitters
Receivers
Bandwidth
Sensors
Phase noise
Mixers
Voltage-controlled oscillators
60 GHz
antenna-in-package
gesture sensing
mm-wave
radar
- Language
- ISSN
- 0018-9200
1558-173X
This work presents a highly integrated 57–64 GHz 4-channel receiver 2-channel transmitter chip targeting short range sensing and large bandwidth communications. The chip is housed in an embedded wafer level ball grid array package. The package includes 6 integrated patch antennas realized with a metal redistribution layer. The receiver patch antennas have a combined antenna gain of $\approx 10$ dBi while each transmitter antenna has a gain of $\approx ~6$ dBi. The chip features a wide tuning range integrated VCO with a measured phase noise lower than −80 dBc/Hz at 100 kHz offset. Each of the differential transmitter channels shows a measured output power of 2–5 dBm over the complete frequency range. In addition, one transmitter channel features a modulator that can be digitally programmed to operate in either radar or communication mode. Each of the receiver channels has a measured conversion gain of 19 dB, a single-sideband noise figure of less than 10 dB and an input referred 1 dB compression point of less than 10 dBm. With all channels turned on the chip consumes a current of 300 mA from a 3.3 V supply. The functionality of the chip is demonstrated for both sensing and short range wireless communications.