Solder Joint Reliability Performance of Flip Chip Molded Ball Grid Array (BGA) Package for Network/Communication Application
- Resource Type
- Conference
- Authors
- Ong, Kang Eu; Too, Seong Ling; Loh, Wei Keat; Peralta, Christopher; Ong, LayLing; Chan, Choi Keng; Yap, Eng Hooi
- Source
- 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium Electronics Manufacturing and Technology, 31st International Conference on. :179-184 Nov, 2006
- Subject
- Components, Circuits, Devices and Systems
Soldering
Telecommunication network reliability
Flip chip
Electronics packaging
Electric shock
Temperature
Testing
Integrated circuit packaging
Strain measurement
Chip scale packaging
- Language
- ISSN
- 1089-8190
Flip chip molded package solder joint reliability (SJR) performance was evaluated by using mechanical shock and temperature cycling test. Package design factors that influence the SJR performance are considered. Temperature cycling results show that SJR performance decrease with thicker board and solder mask defined pad design. Most of the solder joint failures happen at the die shadow region with solder joint interface crack at package or board interface. As for mechanical shock test, a diagonal bend setup was used to generate the desired dynamic response. Typical failures in shock happen at package corner with solder joint package interface crack and board pad crater. The key finding in shock is the flip chip molded package shock capability is similar to flip chip ball grid array (FCBGA) package regardless of the package size and type.