Low-cost 3D image capture is a popular R&D topic these days driven by a rapid growth in 3D viewing applications such as gaming and 3D movies. This forum commences with an overview of 3D display technologies and applications. It is followed by a 3D capture technology overview, how each method compares in performance, and its key design challenges to be successful in cost driven consumer and industrial applications. World experts on image sensor design will present pixel architectures, devices, circuits and technologies used to build 3D imager chips. Time-of-flight, stereo vision, structured light and multi-aperture imaging will be covered. The forum concludes with a panel discussion providing the opportunity for participants to give feedback and ask questions. The forum is aimed at circuit designers and engineers working in the imaging industry.