Parameter Identification of Distributed Thermal Network for Surface Mount Type Power Semiconductor Packages
- Resource Type
- Conference
- Authors
- Nishi, K.
- Source
- 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :3-4 May, 2021
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Photonics and Electrooptics
Power, Energy and Industry Applications
Signal Processing and Analysis
Surface impedance
Parameter estimation
Electronic packaging thermal management
Inverters
Impedance
Standards
Optimization
power semiconductor
thermal impedance distribution
thermal network
parameter identification
- Language
Power electronics is becoming more important than before with motor application expansion. For size reduction of inverter integrated motor design, accurate temperature prediction of power devices is becoming critical. For up to several hundred-watt motor system, inverter is designed with discrete power devices with standard package. This paper investigates and constructs thermal impedance distribution of heat transfer path for a DPAK package test board.