Instantaneous generation of many flaked particles caused by micro-arc discharge and detection method using load impedance monitoring system — Yuji Kasashima
- Resource Type
- Conference
- Authors
- Motomura, Taisei; Uesugi, Fumihiko
- Source
- 2015 Joint e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM) e-Manufacturing and Design Collaboration Symposium (eMDC) & 2015 International Symposium on Semiconductor Manufacturing (ISSM), 2015 Joint. :1-4 Sep, 2015
- Subject
- Engineering Profession
Fields, Waves and Electromagnetics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Impedance
Discharges (electric)
Monitoring
Plasmas
Etching
Radio frequency
Electrodes
plasma etching
flaked particle
electric field stress
micro-arc discharge
in-situ detection
- Language
In volume manufacture of LSI, particle contamination in plasma etching equipment is among the most serious problems [1]. The particles cause short circuit of LSI and significantly lower production yield. Mass-production equipment must be stopped for cleaning of etching chambers periodically, which gives rise to the reduction in overall equipment efficiency (OEE). Development of particle-free processes and equipment is crucially important to reduce production cost.