This study establishes the groundwork for an industry-applicable, integrated nanosheet-based monolithic CFET process architecture with a gate pitch of 48nm. By introducing the middle dielectric isolation, inner spacer, and n/p source-drain isolation, the vertically stacked nFET-on-pFET nanosheet transistors yield a survival rate of over 90% and demonstrate high on-state current with low leakage, achieving a healthy six-order of magnitude on/off current ratio. This work sets the stage for further CFET development and paves the way for a practical process architecture that can fuel future logic technology scaling and PPAC advancement.