Failure Analysis Of Power Modules; A Look At The Packaging And Reliability Of Large IGBTs
- Resource Type
- Conference
- Authors
- De Lambilly, H.; Keser, H.
- Source
- Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International. :366-370 1992
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Failure analysis
Multichip modules
Packaging
Insulated gate bipolar transistors
Testing
Temperature measurement
Cooling
Assembly
Thermal stresses
Thermal resistance
- Language