The Large-area TIM using Sn-Cu-Ni-Sb quaternary IMC joint material
- Resource Type
- Conference
- Authors
- Ikeda, Hiroaki; Sekine, Shigenobu
- Source
- 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :187-188 Apr, 2023
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Photonics and Electrooptics
Power, Energy and Industry Applications
Signal Processing and Analysis
Thermal resistance
Conductivity
Thermal conductivity
Electronic packaging thermal management
Intermetallic
Compounds
Bonding
Intermetallic Compound
IMC
TIM
Thermal Interface Material
- Language
We have been developing Sn-Cu-Ni ternary IMC (Intermetallic Compound) bonding material as a material for high heat-resistant die attach, taking advantage of its features that suppress isotropic transformation of Sn and also suppress Kirkendall void generation. In this study, we developed a SnCu-Ni-Sb quaternary IMC bonding material with improved high heat resistance (liquidus temperature of 240C) while maintaining high thermal conductivity (43W/m⸳K) as a new application field of TIM (Thermal Interface Material).