Detectability of Open Defects at Interconnects between Dies in 3D Stacked ICs with Relaxation Oscillators
- Resource Type
- Conference
- Authors
- Ohmatsu, Masao; Sako, Fumiya; Ikiri, Yuki; Yotsuyanagi, Hiroyuku; Lu, Shyue-Kung; Hashizume, Masaki
- Source
- 2022 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2022 IEEE. :94-95 Nov, 2022
- Subject
- Bioengineering
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Solid modeling
Three-dimensional displays
Circuit simulation
Printed circuits
Integrated circuit interconnections
Integrated circuit modeling
Oscillators
open defect
interconnect test
assembled circuit board
relaxation oscillator
- Language
- ISSN
- 2475-8418
Detectability of a test method utilizing a relaxation oscillator is examined by circuit simulations for open defects between dies in 3D stacked ICs, The results show that resistive open defects of O.6Ω above are detected.