3D sequential integration: applications and associated key enabling modules (design & technology)
- Resource Type
- Conference
- Source
- 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :3.2.1-3.2.4 Dec, 2021
- Subject
Components, Circuits, Devices and Systems Performance evaluation Three-dimensional displays Design methodology Electron devices - Language
- ISSN
- 2156-017X