Model-based analysis of switch degradation effects during lifetime testing
- Resource Type
- Conference
- Authors
- Do, C.; Lishchynska, M.; Delaney, K.; Fitzgerald, P.; Goggin, R.; Hill, M.
- Source
- 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on. :460-463 Jan, 2012
- Subject
- Fields, Waves and Electromagnetics
Computing and Processing
Components, Circuits, Devices and Systems
Communication, Networking and Broadcast Technologies
Switches
Stress
Mathematical model
Voltage measurement
Micromechanical devices
Degradation
Equations
- Language
- ISSN
- 1084-6999
The paper reports on the transient analysis of the observed decrease in the actuation voltage of MEMS ohmic switches, under a stress condition. A finite difference model (FDM) is developed that provides insight into the contributions of various mechanical factors to the measured changes in switch performance. In particular, the proposed method allows us to investigate the effects of spring constant reduction and plastic deformation of the switch. Such an analysis cannot be done on the basis of an empirical fitting or existing analytical models. The presented method can be used in the lifetime evaluation of the switch and this application is demonstrated.