A two-step de-embedding method valid up to 110 GHz
- Resource Type
- Conference
- Authors
- Bazzi, J.; Kassem, H.; Curutchet, A.; Pourchon, F.; Derrier, N.; Celi, D.; Zimmer, T.
- Source
- 2017 29th International Conference on Microelectronics (ICM) Microelectronics (ICM), 2017 29th International Conference on. :1-4 Dec, 2017
- Subject
- Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
General Topics for Engineers
Power, Energy and Industry Applications
Signal Processing and Analysis
Microelectronics
Conferences
- Language
This paper presents different de-embedding methods applied in semiconductor industry, used to retrieve intrinsic device performances from high frequency S-parameters On-wafer measurement. A de-embedding method with a reduced set of dummies is proposed for conducting accurate on-wafer device measurement in the gigahertz range. The experimental results on a device characteristic up to 110GHz show that it has a comparable accuracy than a more complex one.