Ultra-Thin Bottom-Emission VCSEL-Based Optoelectronic Flexible Printed Circuit Module for High-Speed Transmission
- Resource Type
- Conference
- Authors
- Khan, Zuhaib; Hong, Chung-Yu; Hsieh, Ming-Che; Wu, Chun-I; Lin, Long-Yi; Chen, Chun-Chieh; Cheng, David
- Source
- 2024 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2024. :1-3 Mar, 2024
- Subject
- Communication, Networking and Broadcast Technologies
Photonics and Electrooptics
Optical fibers
Integrated optics
Flexible printed circuits
Stimulated emission
Optical fiber communication
Optical signal processing
High-speed optical techniques
- Language
Innovative integration of back emission VCSEL-based optoelectronic module with optical waveguide achieves remarkable 50Gbps PAM4 optical and 25Gbps NRZ electrical transmission speeds. An ultrathin USB3.2 type C optoelectronic module with 0.2mm thickness has been realized.