Micromachining optical arrays
- Resource Type
- Conference
- Authors
- Dunare, C.; Parkes, W.; Stevenson, T.; Michette, A.; Pfauntsch, S.; Shand, M.; Button, T.; Rodriguez Sanmartin, D.; Zhang, D.; Feldman, C.; Willingale, R.; Doel, P.; Wang, H.; Smith, A.; James, A.
- Source
- CAS 2010 Proceedings (International Semiconductor Conference) Semiconductor Conference (CAS), 2010 International. 01:155-158 Oct, 2010
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Computing and Processing
Etching
X-rays
Silicon
Optical reflection
Optical device fabrication
Optical arrays
X-ray
MOA
deep etch
Bosch process
alkaline solution
roughness
crystal planes
- Language
- ISSN
- 1545-827X
2377-0678
This paper describes two fabrication techniques-dry and wet etching- for microstructured optical arrays (MOAs). The MOAs consist of arrays of channels deep etched in silicon. They use grazing incidence reflection to focus the X-rays through the consecutive aligned arrays of channels, ideally reflecting once off a vertical and smooth channel wall in each array. The MOAs were proposed by the Smart X-ray Optics (SXO) programme as small scale optics for micro-probing of biological cells and tissues. The first fabrication method requires inductively coupled plasma (ICP) using Bosch processes. The second one involves etching silicon wafers in alkaline solutions.