A Closer Look to Fan-out Panel Level Packaging
- Resource Type
- Conference
- Authors
- Braun, Tanja; Holck, Ole; Voitel, Marcus; Obst, Mattis; Voges, Steve; Becker, Karl-Friedrich; Aschenbrenner, Rolf; Schneider-Ramelow, Martin
- Source
- 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Packaging
Market research
Manufacturing
Microelectronics
Compression molding
Fan-out Panel Level Packaging
Warpage and Compression Molding
- Language
Fan-out Wafer and Panel Level Packaging are two of the dominating trends in microelectronics packaging. Both approaches with different flavors as RDL last face-up or face-down have reached maturity and are introduced in high volume manufacturing. This paper discusses warpage in detail as one key challenge in fan-out packaging and how to influence the warpage during processing of a reconfigured panel for Chip first / RDL last approach.