Microfibrous Mesh and Polymer Damping of Micromachined Vibration Isolators
- Resource Type
- Periodical
- Authors
- Bottenfield, B.; Bond, A.G.; English, B.A.; Flowers, G.T.; Dean, R.N.; Adams, M.L.
- Source
- IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(4):543-556 Apr, 2021
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Damping
Vibrations
Isolators
Sensitivity
Acceleration
Electric shock
Q-factor
Harsh environments
MEMS
micromachines
sensor performance
vibration isolation
viscoelastic damping
- Language
- ISSN
- 2156-3950
2156-3985
This article introduces the use of nickel (Ni) and copper (Cu) microfibrous meshes (MFMs) and Sorbothane and polydimethylsiloxane (PDMS) viscoelastic polymers to damp the dynamic response of a silicon micromachined vibration isolator (microisolator) for vibration reliability in mechanically harsh environments. The $9\times 9$ mm 2 microisolator is designed to house a small, packaged MEMS sensor to be isolated from the surrounding environment. Microisolators are fabricated from $\langle 100\rangle $ silicon-on-insulator (SOI) wafers using standard lithography and deep reactive ion etching (DRIE) procedures. The MFMs are attached to the microisolators post-fabrication via solder attachment. We then investigate the transmissibility of the undamped and damped vibration microisolators using laser Doppler vibrometry. The peak transmissibility of the microisolator is significantly reduced for all four cases of polymer or MFM damping. Experimental results are compared to the FEA simulated transmissibility and the analytically calculated transmissibility.