CMP工艺晶圆表面颗粒去除问题的研究 / Study on Particle Removal of Wafer Surface in CMP Process
- Resource Type
- Academic Journal
- Source
- 电子工业专用设备 / Equipment for Electronic Products Manufacturing. 52(1):28-64
- Subject
化学机械平坦化(CMP) 清洗液 颗粒度 - Language
- Chinese
- ISSN
- 1004-4507