真空热压铝和铜的固态连接 / Solid-state bonding between Al and Cu by vacuum hot pressing
- Resource Type
- Academic Journal
- Source
- 中国有色金属学报(英文版) / Transactions of Nonferrous Metals Society of China. 23(2):341-346
- Subject
真空热压 扩散结合 Al-Cu金属间化合物 复合材料界面 界面微观结构 纳米压痕 vacuum hot pressing diffusion bonding Al-Cu intermetallic compound composite interface interface microstructures nanoindentation - Language
- Chinese
- ISSN
- 1003-6326