混合微电路用多芯组瓷介电容加固技术 / Reinforcement Technology of Multi-core Ceramic Capacitor for Hybrid Microcircuit
- Resource Type
- Academic Journal
- Source
- 电子工艺技术 / Electronics Process Technology. 43(1):32-35
- Subject
多芯组瓷介电容;加固;仿真;可靠性 - Language
- Chinese
- ISSN
- 1001-3474