Pb/Sn/Ag焊料-Pd/Ag导体微观形貌随温度的演变 / Microstructure Evolution in Pb/Sn/Ag Solder and Pd/Ag Conductor with Different Temperature Stored Processes
- Resource Type
- Academic Journal
- Source
- 电子工艺技术 / Electronics Process Technology. 42(3):163-165
- Subject
微观形貌 互扩散 稳定扩散层 Pd/Ag导体 - Language
- Chinese
- ISSN
- 1001-3474