一种灌封结构用环氧树脂的固化行为表征和模拟 / Characterization and simulation on the cure behavior of epoxy resin for encapsulation structure
- Resource Type
- Academic Journal
- Source
- 复合材料学报 / Acta Materiae Compositae Sinica. 39(4):1824-1833
- Subject
环氧树脂;固化模拟;灌封结构;残余应力;光纤布拉格光栅 - Language
- Chinese
- ISSN
- 1000-3851