抛光液组分对钽晶圆化学机械抛光的影响 / Effects of components in slurry on chemical mechanical polishing of tantalum wafer
- Resource Type
- Academic Journal
- Source
- 电镀与涂饰 / Electroplating & Finishing. 42(15):65-71
- Subject
钽晶圆 化学机械抛光 电化学测试 磨料 螯合剂 氧化剂 tantalum wafer chemical mechanical polishing electrochemical test abrasive chelating agent oxidant - Language
- Chinese
- ISSN
- 1004-227X