长期湿热下塑封电路Cu-Al和Au-Al的金属间化合物生长差异探究 / Study on the Difference of Intermetallic Compounds between Cu-Al and Au-Al of Plastic Encapsulated Microelectronics in Repeated Hygrothermal
- Resource Type
- Academic Journal
- Authors
- 陈光耀; 冯佳; 虞勇坚; 戴莹; 吕栋; Chen Guang-yao; Feng Jia; Yu Yong-jian; Dai Ying; Lv Dong
- Source
- 电子质量 / Electronics Quality. (1):50-53
- Subject
- 湿热环境;Cu-Al键合;Au-Al键合;金属间化合物
- Language
- Chinese
- ISSN
- 1003-0107
为探究塑封电路Cu-Al、Au-Al键合点在长期湿热环境下的可靠性,分别设置2组湿热应力试验条件加速Cu-Al、Au-Al键合退化.采用扫描电子显微镜(SEM)和能谱仪(EDS)对键合界面形貌、成分进行观测.试验结果表明:湿热环境下塑封电路Cu-Al键合界面金属间化合物生长速率比Au-Al慢的多,具有良好的键合界面,无明显影响力学性能的裂纹、空洞的产生.