引线键合弹坑试验方法和可靠性研究 / Wire bonding crater test method and reliability study
- Resource Type
- Academic Journal
- Source
- 中国集成电路 / China Integrated Circuit. 32(9):83-87
- Subject
弹坑 芯片制程 Pad结构 试验方法 可靠性验证 crater chip processes Pad structure test method reliability verification - Language
- Chinese
- ISSN
- 1681-5289