Spintronics Technology Solutions for Interferometric Thermal-Electromagnetic Sensing
- Resource Type
- Authors
- Wane, S.; Tran, Q. H.; Dinh, T. V.; Eddine, J. A.; Duffourg, F.; Ndagijimana, F.; Bajon, D.; Terki, F.; Rioult, J.; Darroman, J.-L.; Bonnaire, L.; Montfort, O.; Huard, V.; Raskin, Jean-Pierre; Lederer, Dimitri; Bousseksou, A.
- Source
- 2022 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS).
- Subject
- Language
Hybrid electromagnetic (EM) and thermal imaging using spintronic technologies is proposed for sensing circuits and systems in near-field and far-field from DC (Switching-Power) to mmWave frequencies. High resolution spintronic sensors capable of detecting magnetic fields ranging from few tens of mT (milli-Tesla) down to tens of pT (pico-Tesla) are demonstrated spanning about 10 orders of magnitude in dynamic range. A configurable Agile Front-End-Module LNA (AFEM) is combined with spintronics probe-array sensors providing adjustable 80 dB of dynamic range for subsequent processing of MIMO correlations in time and frequency domains. The proposed hybrid EM-Thermal sensing solution is applied to mmWave beamforming modules demonstrating the possibility of extracting power-density and energy-density metrics as a function of beamforming angles. An infrared (IR)- Visual dual-camera is introduced together with augmented reality (AR) based on 3D non-uniform spatial-sampling. Porting of chemically functionalized spintronic sensing materials into advanced FD-SOI platforms is proposed using advanced MRAM/SRAM process technologies.