Phase interfaces between AlTiN and WC/Mo 2 C in WC–Mo 2 C substrate and the related characteristics
- Resource Type
- Authors
- Hua-dong Zhang; Guo-Kai Luo; Jun-Jie Zhu; Qiao-Ping Xiao; Li Zhang; Lei Zhou; Yi Chen
- Source
- International Journal of Refractory Metals and Hard Materials. 72:323-331
- Subject
- Materials science
020502 materials
Alloy
02 engineering and technology
engineering.material
Sputter deposition
021001 nanoscience & nanotechnology
Epitaxy
Grain size
0205 materials engineering
Coating
Scratch
High adhesion
engineering
Composite material
0210 nano-technology
High-resolution transmission electron microscopy
computer
computer.programming_language
- Language
- ISSN
- 0263-4368
To explore the synergistic effect of the hard phase and the ductile binder phase in hardmetal substrate to the coatings, a binderless WC–6Mo2C–0.68Cr3C2–0.37VC (bWC) model alloy and a WC–10Co–0.65Cr3C2–0.35VC reference alloy with similar grain size (~0.4 μm) were used as substrates. Ti0.94Si0.06N/TiAlSiN/Al0.52Ti0.48N coating was deposited by DC magnetron sputtering. Scratch testing (loading range 0–30 N) results show that complete removal of the coating on bWC substrate occurs under a substantially higher critical load LC2 (28.3 N vs. 21.4 N), but accompanied by a quite earlier cohesion failure expressed by LC1 (LC2 − LC1 = 16.4 N vs. 1.0 N). To reveal the reason behind the high adhesion strength, phase interfaces between AlTiN and WC/Mo2C based phase in bWC substrate were investigated by HRTEM. Coherent and semi-coherent epitaxial growth relationships at the AlTiN/WC interfaces and semi-coherent epitaxial growth relationships at the AlTiN/Mo2C interfaces are easily identified. The minimum lattice misfit (1.9%) is observed when AlTiN growths on (0001)WC along its 4 ¯ 2 2 ¯ direction. The reasons behind the related phenomena are discussed.