Polyimide insulators for multilevel interconnections
- Resource Type
- Authors
- Arthur M. Wilson
- Source
- Thin Solid Films. 83:145-163
- Subject
- Interconnection
Materials science
Metals and Alloys
Surfaces and Interfaces
Substrate (electronics)
engineering.material
Photoresist
Conductivity
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Corrosion
Coating
Chemical-mechanical planarization
Materials Chemistry
engineering
Composite material
Polyimide
- Language
- ISSN
- 0040-6090
Polyimide films are reliable high temperature planarizing insulators for multilevel interconnection systems, which may be the key to high yielding bipolar and MOS very large-scale integrated circuits. In this paper we review the chemical, mechanical and thermal properties of polyimides. The important process steps are traced: planarization by coating, adhesion and patterning both by photoresist masking and by photosensitization of the polymide film. Reliability discussions include the influence of sodium ions on h FE at high temperatures and the effect of water contamination of the starting copolymers on the high temperature stability of the final cured resin. Emphasis is placed on the importance of polyimide adhesion to the substrate in order to retard the metal lead corrosion that occurs at high temperatures and under conditions of moisture. Methods to deal with the higher conductivity of polyimide relative to that of ceramic insulators are summarized.