Complementary FET (CFET) is a promising booster for further area reductions in static random-access memory (SRAM) cells. However, the performance degrading by a series of parasitic parameters in these SRAM cells will diminish the scaling benefit introduced by new transistor architectures. In this article, we propose a universal methodology to determine the layout optimization direction of 6T static random-access memory (6T-SRAM) cells by studying the sensitivity of 6T-SRAM cell performance to various parasitic parameters. And adopt this method to optimize the CFET SRAM cell layout structure under the advanced nodes beyond 3 nm. The performances of CFET 6T-SRAM cells with different layout schemes are comparatively evaluated. It is found that the influence of the parasitic resistance on 6T-SRAM performances is double-sided, and parasitic resistances from transistor to power rail ( ${R}_{\mathrm {pds}}$ , ${R}_{\mathrm {pud}}$ ) and from access (AX) devices to bit-lines (BLs) ( ${R}_{\mathrm{bax}}$ ) have the most important effect on improving read noise margin (RNM) together with write margin (WM). The BL-first scheme with reduced ${R}_{\mathrm{bax}}$ and increased ${R}_{\mathrm {pud}}$ is proven to have 76.3% improvement in WM and 122.5% decrease in write time (WT) compared to the BL-last scheme, and a 63.8% improvement in RNM compared to conventional nanosheet architecture. Further optimized ${R}_{\mathrm{bax}}$ in the buried-BL scheme is proven to have higher WM, as well as lower WT. The BL-first scheme and buried-BL scheme is proven to be the most efficient approach to boost CFET SRAM performance.