Bonding BGA packages requires integrated solutions.
- Resource Type
- Article
- Authors
- Christie, Leroy; Levine, Lee; Eshelman, Mark
- Source
- Semiconductor International; Jul98, Vol. 21 Issue 8, p311, 5p, 6 Black and White Photographs, 6 Graphs
- Subject
- WIRE bonding (Electronic packaging)
BALL grid array technology
- Language
- ISSN
- 01633767
Focuses on bond wire, wire capillaries and bonding parameters, integrated solutions used for advanced ball-grid array (BGA) packaging. Difficulties encountered in wirebonding in BGAs; Reference to BGAs being too technically complex to bond; What the BGA structure is based on; Information on the design of experiment (DOE) technique used in the bonding application.