Thermal Performance of LED Filament in Flip-Chip Packaging Manufactured for Different Correlated Color Temperature.
- Resource Type
- Article
- Source
- Applied Sciences (2076-3417); Oct2021, Vol. 11 Issue 19, p8844, 8p
- Subject
FLIP chip technology COLOR temperature FIBERS LIGHT emitting diodes THERMAL resistance THERMAL properties - Language
- ISSN
- 20763417