A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images.
- Resource Type
- Article
- Source
- Micromachines; Jun2023, Vol. 14 Issue 6, p1119, 18p
- Subject
CONVOLUTIONAL neural networks X-ray imaging CONSUMPTION (Economics) INTEGRATED circuits ELECTROSTATIC discharges ENERGY consumption - Language
- ISSN
- 2072666X