Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices.
- Resource Type
- Article
- Source
- Applied Sciences (2076-3417); Apr2023, Vol. 13 Issue 8, p5209, 16p
- Subject
THERMAL analysis TEMPERATURE distribution FINITE element method SEMICONDUCTOR devices TEMPERATURE - Language
- ISSN
- 20763417